Features

- Fast, efficient surface treatment and cleaning prior to
  wire bonding, die attach, encapsulation, conformal
  coating, underfill and more

- Uniform plasma treatment across all part surfaces
  with its three-axis symmetrical chamber design

- Proprietary software control with intuitive graphical
  interface for easy touch-screen programming

- Ultimate application flexibility for direct, downstream
  and downstream ion-free plasma treatment

- Full front access to all interior components allows for
  convenient maintenance